LG Innotek to expand chip substrate plant in Vietnam

LG Innotek is expanding its semiconductor substrate manufacturing footprint to Vietnam with a new production plant as part of a broader strategy to diversify production and scale up its package solutions business. The company said that it signed a memorandum of understanding at the company’s headquarters in Gangseo District, Seoul, with the city of Hai Phong to build a semiconductor substrate production facility in northern Vietnam. The new facility, scheduled to begin construction in July and be completed in May 2027, will span about 330,000 square meters, roughly equivalent to 45 soccer fields. The expansion will be funded directly by LG Innotek’s Vietnamese subsidiary. The plant will produce a range of advanced semiconductor substrates, including radio frequency system-in-package (RF-SiP), flip chip-chip scale package (FC-CSP), and flip chip-ball grid array (FC-BGA). “Under the dual-manufacturing strategy, our local facility in Gumi will serve as a mother factory dedicated to developing new technologies and producing new models and high-value products, while the expanded VietnamWeiter zum vollständigen Artikel bei Korea Times Weiter zum vollständigen Artikel bei Korea Times