EQS-Adhoc: LPKF receives purchase LOI from leading Asian advanced semiconductor packaging manufacturer, confirming equipment selection for production ramp-up

 

Ad hoc-Announcement - Inside information pursuant to Article 17 MAR

LPKF receives purchase LOI from leading Asian advanced semiconductor packaging manufacturer, confirming equipment selection for production ramp-up

Garbsen, 23 September 2026 – LPKF Laser & Electronics SE has received a Letter of Intent (LOI) from a leading Asian advanced semiconductor packaging manufacturer for the purchase of its NEXAR LIDE glass processing systems, confirming the selection of LPKF in the equipment stack. The customer plans to use the systems for the initial ramp-up of its glass substrate production facility for high-performance advanced packaging solutions. The letter confirms the intent to purchase equipment in the mid-single-digit million euro range, with the order expected shortly. The project supports LPKF’s growth strategy in glass-based advanced packaging for high-performance computing and AI applications. 

 

 

Contact:
Bettina Schäfer, Department Manager Group Communication & Investor Relations