Samsung Electronics to scale down chip production to brace for strike impact

Samsung Electronics is bracing for the impact of its labor unions’ planned 18-day general strike, scheduled to start on May 21, activating contingency measures to minimize disruptions, including adjusting chip production processes and limiting new wafer input volumes. According to industry officials on Thursday, the company has begun emergency management measures as the likelihood of a strike next week has increased, with the latest round of labor-management negotiations having ended without progress. The unions have rejected the possibility of further talks and reiterated their demands. Since the strike may cause large-scale production disruptions and quality issues stemming from workforce shortages in its chipmaking division, the company is considering a “warm-down” process. Chip plants typically require preemptive adjustments to production operations at least a week in advance because halting manufacturing processes midway can result in huge losses. “Unlike other industries, semiconductor manufacturers need to begin adjusting production volumes and quality control measuresWeiter zum vollständigen Artikel bei Korea Times Weiter zum vollständigen Artikel bei Korea Times